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About This Role
- Intel Corporation is one of the world's leading semiconductor companies, driving innovation across computing, connectivity, and artificial intelligence.
- With a legacy of over 50 years of technological breakthroughs, Intel empowers billions of people globally through world-class products and solutions.
- Our teams are made up of bold thinkers, problem-solvers, and innovators who are passionate about shaping the future of technology.
- At Intel, we believe in creating an inclusive workplace where diverse perspectives fuel creativity and drive meaningful impact.
- Intel's Packaging Module Development team is seeking a talented and driven Packaging Process Development Engineer to join our Arizona-based team.
- In this role, you will be at the forefront of advancing next-generation semiconductor packaging technologies, playing a critical part in Intel's product roadmap.
- You will develop and optimize innovative assembly processes and equipment, directly influencing the performance, reliability, and quality of Intel's cutting-edge products.
- This is a unique opportunity to make a lasting impact on the semiconductor industry while working alongside some of the brightest minds in the field.
- Key Responsibilities: Develop and optimize assembly media and collaterals to achieve quality, reliability, cost, yield, productivity, and manufacturability targets.
- Apply Design of Experiments (DOE) and Statistical Process Control (SPC) principles to refine media and collateral capabilities, documenting findings through detailed technical reports.
- Design and maintain equipment to evaluate media and collateral performance under simulated field conditions, including temperature cycles, heat, humidity, and dynamic mechanical forces.
- Ensure manufacturability of physical prototypes and oversee the full lifecycle of manufacturing workflows.
- Define material specifications and collaborate closely with supplier quality and procurement teams to maintain compliance with quality and performance benchmarks.
- Leverage a deep understanding of failure mechanisms to establish reliability benchmarks aligned with customer requirements.
- Lead problem-solving initiatives and champion continuous improvement efforts for media and collaterals.
- Standardize manufacturing qualification practices and quality systems while managing technical risks in alignment with product milestones and supplier delivery schedules.
- Serve as a subject matter expert, providing technical consultation to internal teams and external partners on media and collateral solutions.
- As a Successful Candidate, You Will Bring: Collaborative mindset – You thrive in cross-functional team environments and build strong relationships with colleagues, suppliers, and partners.
- Analytical thinking – You approach complex problems with a structured, data-driven mindset and a passion for finding root causes.
- Effective communication – You can clearly articulate technical concepts to both technical and non-technical audiences, both verbally and in writing.
- Adaptability – You are comfortable navigating ambiguity and shifting priorities in a fast-paced, innovation-driven environment.
- Attention to detail – You take pride in precision and thoroughness, ensuring quality and accuracy in everything you do.
- Initiative & ownership – You proactively identify opportunities for improvement and take ownership of outcomes from start to finish.
- Resilience – You remain focused and solution-oriented when faced with challenges or setbacks.
- Are you ready to make your mark on the future of semiconductor packaging? Join Intel's team of world-class innovators in Arizona and help redefine what's possible in next-generation packaging technologies.
- Apply today and take the next step in your engineering career at one of the most iconic technology companies in the world.
Requirements
- to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience.
Requirements
- Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or related STEM field with 2+ years of experience OR master's degree in mechanical engineering, Materials Science, Metallurgical Engineering, or related STEM field Relevant experience should be in the following: Knowledge of mechanical design software such as SolidWorks or AutoCAD.
- Mechanical drawings, Geometric Dimensioning and Tolerancing (GD&T) principles Preferred Qualifications: 2+ years of experience in: Statistical Process Control (SPC) and Design of Experiments (DOE) methodologies.
- Drive technical innovation and manage complex, time-sensitive projects.
- High-precision manufacturing methods, including stamping and CNC machining.
- Semiconductor fabrication processes and packaging technologies.
- Supply chain management in a manufacturing or materials qualification environment.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $99,030.00-188,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
Your application goes straight to Intel.
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Specialisation
Open roles at Intel
666 positions
Job ID
/job/US-Arizona-Phoenix/Packaging-Process-Development-Engineer_JR0287865-1
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