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About This Role
- Note: This role requires regular onsite presence to fulfill essential job responsibilities.
- Develops assembly processes and/or equipment and applies innovative engineering concepts to enable Intel’s future assembly packaging platform technologies.
- Optimizes and improves manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability goals.
- Develops process and equipment specifications using principles of design of experiments (DOE), data analysis, and statistical methods to support process development and continuous improvement initiatives.
- Documents technical findings, improvements, and best practices through technical reports and white papers.
- Develops, maintains, and evaluates equipment and processes used to assess silicon and package technologies under simulated field-use conditions, including heat, humidity, temperature cycling, and dynamic force environments.
- Ensures manufacturability of package designs and supports manufacturing process flows, procedures, and implementation activities.
- Collaborates with cross-functional engineering, manufacturing, supplier quality, and procurement teams to establish material specifications and ensure vendor performance and material quality standards are met.
- Supports process and equipment innovation efforts focused on reliability, quality, and manufacturing efficiency.
- Leads problem-solving and process improvement activities using experimental design methodologies and engineering analysis techniques.
- Provides technical consultation related to packaging and manufacturing process improvements and supports customer or stakeholder requests as needed.
- Continuously partners with packaging technology development and engineering teams to drive process standardization, manufacturing quality improvements, and future technology readiness.
Requirements
- to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Requirements
- Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science Engineering, Industrial Engineering, or a related engineering or science discipline with 5+ years of engineering industry experience; OR Master’s degree in a related engineering field with 3+ years of engineering industry experience; OR PhD in a related engineering field with 6+ months of engineering industry experience.
Nice to Have
- Experience in semiconductor manufacturing and/or advanced packaging technologies.
- Experience with packaging process development, assembly equipment, or manufacturing optimization.
- Knowledge of reliability testing, failure analysis, and process qualification methods.
- Experience working in high-volume manufacturing or technology development environments.
- Strong collaboration and communication skills with cross-functional teams and external suppliers.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
Your application goes straight to Intel.
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Specialisation
Open roles at Intel
713 positions
Job ID
/job/US-Arizona-Phoenix/Packaging-Module-Equipment-Development-Engineer_JR0284262
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