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About This Role
- The Role and Impact As a Packaging Module Development Engineer, you will play a pivotal role in advancing Intel's assembly and packaging technologies.
- You will develop and optimize processes, equipment, and materials to enable the next generation of innovative packaging solutions.
- Your daily work will directly contribute to improving manufacturing efficiency and the quality, reliability, and scalability of Intel's products.
- Business Group Join Intel's Substrate Packaging Technology Development (SPTD) organization, a leader in developing cutting-edge substrate and packaging solutions.
- SPTD enables Intel’s advanced packaging technology roadmap through materials innovation, process optimization, and equipment development, supporting the delivery of affordable, high-performance products to the global market.
- Key Responsibilities Drive innovation in packaging technology by identifying early-stage reliability issues and developing effective solutions.
- Optimize equipment configurations, process specifications, and integration flows to enable advanced packaging technologies.
- Collaborate with cross-functional teams to design and execute experiments that evaluate process and material interactions.
- Lead continuous improvement initiatives to enhance process capability, stability, productivity, automation, yield, and manufacturability.
- Establish material specifications and partner with supplier quality teams to ensure compliance with requirements, with a particular focus on dielectric materials and processes.
- Apply statistical methods and design of experiments (DOE) principles to characterize processes, solve complex technical challenges, and improve performance.
- Drive the development of next-generation patternable dielectric materials and fabrication processes to scale advanced semiconductor packaging capabilities.
- Manage projects to ensure alignment with product development schedules, milestones, and execution goals.
- Respond with urgency and professionalism to foundry customer requests, escalations, and manufacturing events.
- Document technical advancements through papers and contribute to knowledge sharing across the organization.
- The ideal candidate will demonstrate: • Technical leadership, strategic planning, and critical thinking skills. • Ability to coach, mentor, and develop technical teams. • Adaptability and comfort working in ambiguous, fast-paced environments. • Flexibility in managing changing priorities and responsibilities. • Experience leading teams within highly matrixed organizations. • Strong initiative and the ability to work independently. • Excellent communication, influencing, technical, and analytical skills.
Requirements
- are required to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Minimum Qualifications - Bachelor's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or a related field, with 6+ years of related experience; OR - Master's degree in the above fields, with 4+ years of related experience; OR - PhD in the above fields, with 2+ years of related experience.
- Experience listed above should be a combination of the following: - Proficiency in design of experiments (DOE), statistical data analysis, and/or process control tools. - Semiconductor or packaging processing experience.
- Preferred Qualifications - 2+ years of experience with material development such as patternable dielectric materials formulations is a plus. - Hands-on experience with dielectric/photo-resist patterning process development, including lamination or coat/bake/develop optimization, resist profile engineering, and process window characterization - Hands-on experience developing experimental setups to validate modeling and simulation.
- We invite you to be part of a passionate team that values innovation, collaboration, and excellence.
- Apply now to contribute to groundbreaking advancements in packaging technology while growing your career in a dynamic and supportive environment.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $133,800.00-219,550.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
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Specialisation
Open roles at Intel
618 positions
Job ID
/job/US-Arizona-Phoenix/Packaging-Module-Development-Engineer_JR0286552
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