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About This Role
- The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms.
- Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.
- The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by: • Developing thermal interface technology and material solutions to support Intel's future packaging platforms. • Collaborating with multifunctional and cross-organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability. • Innovating next generation materials, equipment, and fabrication processes to enhance semiconductor packaging capabilities at scale. • Managing projects to meet product development timelines. • Applying formal education and judgment to solve technical problems. • Providing sustaining support for equipment performance and process health in high-volume manufacturing. • Responding promptly to foundry customer requests and events.
- The ideal candidate will demonstrate: • Technical leadership, strategic planning, and critical thinking. • Ability to coach and develop technical teams. • Tolerance for ambiguity and adaptability in a dynamic environment. • Flexibility in managing changing priorities and responsibilities. • Experience leading teams in a highly matrixed organization. • Initiative and ability to work independently. • Strong communication, influencing, technical, and analytical skills.
- This position requires regular onsite presence.
Requirements
- to be initially considered for this position.
- Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.
- Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences.
Requirements
- Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, Chemical Engineering, or a related STEM field with 1+ years of relevant experience • -OR- PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, Chemical Engineering, or a related STEM field • Minimum GPA of 3.5. • At least one publication in a peer-reviewed technical journal.
Nice to Have
- One or more years of experience in any of the following: • Delivering results for complex, time-critical technical projects. • Semiconductor fabrication processes and technology. • Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE). • Previous related work experience in a semiconductor foundry.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $99,030.00-188,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
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Specialisation
Open roles at Intel
601 positions
Job ID
/job/US-Arizona-Phoenix/Packaging-Module-Development-Engineer_JR0285729
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