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About This Role
- Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer.
- In this pivotal role, you will shape the future of advanced IC packaging solutions by driving process and equipment innovations critical to Intel's roadmap for assembly packaging platform technologies.
- Your contributions will empower the manufacturability of next-generation products, ensuring they meet stringent quality, reliability, cost, yield, and productivity requirements.
- As part of a collaborative and forward-thinking team, you'll tackle complex challenges, develop cutting-edge methods, and push the boundaries of what's possible in packaging technology.
- Be part of a dynamic environment where your expertise and creativity will make a meaningful impact on Intel's success and leadership in the semiconductor industry.
- Key Responsibilities Develop and optimize advanced packaging processes and equipment to support Intel's Glass Core and CPO roadmap.
- Define and implement process specifications, equipment configurations, and workflows for new technologies, ensuring seamless integration into manufacturing.
- Apply design of experiments (DOE) principles to characterize process windows and understand the interactions between equipment, materials, and processes.
- Drive continuous improvements in process capability, quality, reliability, cost, yield, automation, and productivity.
- Develop and maintain equipment for testing silicon and package technologies under simulated field conditions, including thermal, humidity, and mechanical stress environments.
- Collaborate with supplier quality and procurement teams to ensure material specifications and vendor performance meet strict quality standards.
- Lead efforts to develop innovative techniques, tools, and methods to accelerate technology readiness and identify risks early in the development cycle.
- Document advancements through white papers, technical reports, and data analysis.
- Partner with cross-functional engineering teams and external stakeholders to address packaging challenges and align solutions with Intel's strategic goals.
Requirements
- are required to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Requirements
- Bachelor's or MS degree in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry, or a related technical field. +4 years of experience in: Process development, equipment adjustment, and manufacturing process control.
- Design of experiments (DOE) principles and statistical data analysis.
- Process characterization and statistical process control methodologies.
- Material testing and characterization techniques such as DSC, TGA, D/TMA, ICPMS, FTIR, or SEM.
- Preferred Qualifications Master's degree with 3 or more years, or PhD degree with 0 years of experience in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related technical field.
- Analytical skills and experience troubleshooting integrated technology challenges.
- Advanced statistical tools, process control frameworks, and Microsoft Office software suite applications.
- Experience working with both organic and inorganic materials in packaging processes. 1 year of Photolithography experience.
- Join Intel's mission to innovate and lead in the field of advanced packaging technologies.
- Apply now to become part of the team shaping the future of semiconductor manufacturing.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
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Specialisation
Open roles at Intel
646 positions
Job ID
/job/US-Arizona-Phoenix/Packaging-Module-Development-Engineer_JR0285601
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