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About This Role
- Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in advancing Intel's next-generation assembly and packaging platform technologies.
- This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at the forefront of the technology landscape.
- You will directly contribute to the development, optimization, and integration of processes and equipment that shape the future of product performance, quality, and reliability.
- By leveraging your technical expertise, you will help ensure that Intel delivers exceptional results to meet the demands of a rapidly evolving industry.
- Key Responsibilities: Design and develop assembly processes and equipment to enable future packaging technologies.
- Optimize manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
- Create and maintain specifications for processes and equipment using Design of Experiments (DOE) and data analysis principles.
- Conduct tests under simulated field conditions, including heat, humidity, temperature cycling, and dynamic forces, to evaluate silicon and packaging technologies.
- Oversee the manufacturability of package designs and manage their manufacturing cycles.
- Establish material specifications and collaborate with supplier quality and procurement teams to ensure compliance with performance requirements.
- Develop innovative techniques, tools, and quality screens to assess packaging quality and reliability.
- Set reliability standards based on a strong understanding of failure mechanisms and influence design, material selection, and process development accordingly.
- Provide consultation and technical support for packaging process improvements and respond to customer and client needs.
- Drive standardization in product qualification and manufacturing quality systems while collaborating with engineering teams to meet key product milestones.
Requirements
- Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related field with 1+ years of relevant experience or Master's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related field.
- Experience listed above should be a combination of the following: Familiarity with equipment adjustment, process characterization, and manufacturability or electronics assembly.
- Preferred Qualifications Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
- Hands-on experience in a technology manufacturing environment or semiconductor packaging processes.
- Demonstrated ability to collaborate with cross-functional teams and contribute to time-sensitive projects.
- We invite you to apply and bring your expertise, creativity, and passion for innovation to Intel.
- Be a part of our mission to create world-class packaging solutions and help shape the future of technology.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $85,200.00-162,500.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
Your application goes straight to Intel.
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Specialisation
Open roles at Intel
713 positions
Job ID
/job/US-Arizona-Phoenix/Packaging-Module-Development-Engineer_JR0284263
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