Package Failure Analysis Engineer

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About This Role

  • The Role and Impact As a Manufacturing Failure Analysis Engineer, you will play a critical role in enhancing Intel's manufacturing processes and product quality.
  • By identifying and investigating component failures, your work will directly contribute to improving the yield, reliability, and performance of next-generation silicon technologies and products.
  • In this position, your expertise will be pivotal in solving complex technical challenges, driving innovation, and sharing insights that strengthen Intel's global manufacturing capabilities.
  • You'll collaborate with teams across multiple disciplines, leveraging advanced methodologies and tools to uncover root causes of failures and implement solutions that shape the future of technology.
  • Key Responsibilities - Conduct electrical validation and fault isolation for products that fail testing, identifying and analyzing physical defects linked to electrical failures. - Perform in-depth evaluations of assembly, fab, or substrate processes and material characteristics to determine failure modes and mechanisms. - Utilize advanced analytical tools, including Parametric Analyzer (I/V analysis), Keithley meter, TDR, EOTPR, SEM/EDX, FIB, FTIR, X-Ray, Acoustic Imaging, and IR Imaging Tools, to understand failure modes and mechanisms. - Develop and implement failure analysis strategies and methodologies to address new and complex manufacturing challenges. - Publish analytical reports detailing failure mechanisms, root causes, and recommended corrective actions to prevent recurring issues. - Support new technology and product transfers, ensuring seamless integration into manufacturing processes and proliferating best-known methods across global sites. - Drive continuous improvements in analytical techniques and metrologies for quality and reliability (QnR) applications. - Collaborate across teams to analyze failure reports, recommend solutions, and share lessons learned to enhance organizational knowledge.

Requirements

  • Bachelor's degree in Engineering, Physics, Chemistry, or a related specialized field. - Proficiency in operating analytical tools such as Parametric Analyzer, TDR, SEM/EDX, FIB, FTIR, X-Ray, and Acoustic Imaging. - Demonstrated experience in fault isolation, defect detection, and failure analysis in manufacturing or research settings. - Technical understanding of material properties and device interactions. - Strong problem-solving skills with the ability to analyze complex data and draw actionable conclusions.
  • Preferred Qualifications - Master's degree in Engineering, Physics, Chemistry, or related fields. - Experience with additional material analysis techniques such as FTIR, XPS, and Tof-SIMS. - Proven ability to innovate and develop new methodologies for failure analysis. - Excellent communication skills, with experience writing technical reports and presenting findings. - A collaborative mindset, with experience working in cross-functional teams in a manufacturing or research environment.
  • We invite you to be part of a dynamic, innovative team that values your expertise and empowers you to make a lasting impact.
  • Join us and help shape the future of technology.

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Intel

Malaysia, Kulim

Specialisation
Open roles at Intel
713 positions
Job ID
/job/Malaysia-Kulim/Package-Failure-Analysis-Engineer_JR0284290-1

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