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About This Role
- The Role and Impact As a Module Development Engineer, you will play a pivotal role in driving advancements in Intel's semiconductor manufacturing technologies.
- Your contributions will focus on developing and enabling cutting-edge processes for high-volume manufacturing while laying the groundwork for future technological innovations.
- By leveraging your expertise in process development, equipment optimization, and material science, you will be instrumental in creating robust, scalable solutions that align with Intel's commitment to leadership in semiconductor technology.
- Working cross-functionally with internal teams and external partners, you will ensure seamless integration of advanced manufacturing processes to meet product performance, yield, and reliability standards.
- Key Responsibilities - Lead the design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design. - Drive technology development and enablement for both high-volume manufacturing and future technologies. - Perform feasibility studies using simulations and engineering methodologies to meet desired device specifications. - Conduct pathfinding activities to develop innovative process solutions for next-generation device architectures. - Develop and implement technology roadmaps to guide future manufacturing needs. - Collaborate with equipment and material suppliers to design and implement enabling process technologies. - Optimize production efficiency, manufacturing techniques, and output for existing and new products. - Utilize statistical process control and data analytics to enhance process stability and drive continuous improvements. - Recommend and execute modifications to operational equipment to boost efficiency and manufacturing scalability. - Partner with cross-functional teams to ensure alignment on process integration and project deliverables.
- The candidate should demonstrate the following behavioral traits. - Strong problem-solving skills and ability to address complex technical challenges. - Proven track record of collaboration with cross-functional teams, including yield, operations, and supplier management.
Requirements
- are required to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
- Minimum Qualifications - PhD degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM discipline with 1+ years of relevant experience. - OR Master's degree in the same fields with 4+ years of experience.
- Experience listed above should be a combination in the following: - Manufacturing process development experience, statistical process control, process improvement, and data analytics. -Hands on experience in wafer-level assembly, semiconductor processing, or advanced packaging technology development.
- Preferred Qualifications - Experience in wafer-level assembly, epoxy, mold materials, annealing or related fields in advanced packaging. - Demonstrated expertise in leading programs from strategy formation to high-volume production. - Familiarity with advanced packaging technologies such as hybrid bonded interconnects, RDL-based packaging, or ultra-fine pitch solder connections. - Experience in design rule development for Manufacturability/ REL Join Intel's team and help shape the future of semiconductor technology through innovation and excellence.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
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Specialisation
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649 positions
Job ID
/job/US-Oregon-Hillsboro/Module-Development-Engineer_JR0284965
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