Module Development Engineer

Requirements

• PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 6+ months of relevant experience OR Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 3+ years of relevant experience OR Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of relevant experience Relevant recent experience includes, but is not limited to: Hands-on experience in dry etch semiconductor processing within a manufacturing or manufacturing adjacent Research and Development environment Strong understanding of plasma etch fundamentals, including plasma–surface interactions, selectivity, profile control, and defect mechanisms Demonstrated experience with process development, optimization, and characterization for advanced semiconductor technologies Proficiency in statistical data analysis and design of experiments (DOE) using tools such as JMP, Python, or MATLAB Experience operating, qualifying, and troubleshooting semiconductor manufacturing equipment in a cleanroom environment Ability to analyze complex process data, identify root causes, and implement data driven corrective actions Preferred Qualifications: 3+ years of direct experience developing and ramping dry etch processes for advanced technology nodes in a high volume manufacturing or foundry environment Experience with one or more of the following dry etch technologies: ICP / CCP plasma etch High aspect ratio etch (HARC) Atomic layer etch (ALE) EUV patterned layer etch integration Demonstrated contributions to yield improvement, defect reduction, profile control, or process window expansion at the module or integration level Working knowledge of advanced device architectures (e.g., FinFET, GAA, nanosheets) and their etch specific challenges Experience with physical and materials characterization techniques, such as SEM, TEM, CD SEM, AFM, XPS, or ellipsometry Familiarity with image analysis and automated data processing techniques for metrology and defect inspection Proven ability to work effectively with cross functional teams (integration, lithography, CMP, device, yield, equipment suppliers) to deliver robust manufacturing solutions Demonstrated technical leadership within projects, including mentoring junior engineers or influencing technical direction without formal authority.
• For information on Intel’s immigration sponsorship guidelines, please see Intel U.S.
• Immigration Sponsorship Information Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly.
• We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments.
• Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
• It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel .
• Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
• Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
• Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.