Memory Circuit Design Engineer

About This Role

• You will be partnering with and leveraging domain experts across various areas of technology development, EDA vendors and product design teams to develop and deliver high-quality industry-leading memory technology collaterals and to drive circuit innovations that enable next generation high-performance, high-density, low-power embedded memory designs on Intel advanced CMOS process technologies.
• In this position your responsibilities will include, but may not be limited to: Memory pathfinding activities and power, performance and area (PPA) optimization through design technology co-optimization (DTCO) and product design enablement.
• Memory bit-cell and complex periphery IC layout and automation.
• Memory array/IP design, memory circuit innovation, test-chip design.
• Pre-Si verification, post-Si validation and debugging to enable yield and parametric tracking/ramp.
• The Advanced Design (AD) team is part of Intel's larger Design Technology Platform (DTP) Organization and is focused on pathfinding and development of advanced memory technology.
• These circuits enable best-in-class memory collateral, IP and innovative product design across all generations of Intel process technology.
• At Intel, DTP is one of the key pillars enabling Intel to deliver winning products in the marketplace.
• Your work will directly enable Intel's internal and external customers to get to the market faster with products that include high-performance, high-density, low-power memory at the leading edge of the technology curve and implemented in Intel's advanced CMOS process technologies.