Inspection Development Engineer

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Become a member of the Advanced Packaging Technology and Manufacturing -Technology Development (APTM-TD) Media, inspection, Handling System and Laser (MIHL) module engineering team in Kulim as a Inspection development engineer leading the development and deployment of Intel's advanced chip packaging process technology.
In this role, you will focus on packaging inspection technologies across assembly, test, and finish processes.
You will work with Assembly and Test development teams, Manufacturing, QnR, and Yield Engineering to establish metrology and defect inspection capabilities that accelerate process development and ensure effective outgoing quality screening aligned with the company roadmap.
Your responsibilities include, but are not limited to: Development of various Inspection process recipes and understanding material interactions while delivering to our quality and reliability standards.
Engage with product design to define product Inspection module FMEA and review drawings compared against Inspection module design rules.
Assessment and development on new inspection capability /criteria request from various customers.
Engage in AID (Auto Inspection and Disposition ) and next generation Machine Learning model development and optimization.
Drive improvements in quality, reliability, cost, yield, process stability, productivity and safety/ergonomics.
Engaging in testing and validating hardware/software upgrades to meet product requirements.

Bachelor's or Master's degree in Engineering or Physics or Computer Science or related STEM field.
Fundamental physical processes, troubleshoot complex ultra-high precision equipment across a variety of disciplines including optical, laser, motion or electrical systems.
Experience with and understanding of Optics fundamentals as applied to imaging techniques (light sources, resolutions, algorithm applications), light-matter interaction.
Strong understanding of statistical principles, statistical process control (SPC) and Design of Experiments (DOE) Ability to apply fundamental scientific and engineering principles to develop novel design solutions for high volume manufacturing processes.
Preferred Qualifications 6+ months of experience Bachelor's or Master's degree in one or more of the following: Semiconductor Inspection (wafer, package, etc.).
Optics fundamentals as applied to imaging techniques (light sources, resolutions, algorithm applications), light-matter interaction.
Data science and statistics tools (Python is highly preferred).
Data management and visualization experience.
Machine Vision techniques, OpenCV experience and CNN Image Classification.
Dimensional management for package features and planes.

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