Opens intel.wd1.myworkdayjobs.com in a new tab
About This Role
- Delivers signal integrity, power integrity and radio frequency and electromagnetic compatibility solutions for large, complex high-speed platforms, boards, packages, and silicon.
- Develops and analyzes 2D and 3D model extraction across die/C4 bumps, silicon, package, sockets, and boards.
- Defines specification/rules, reviews implementation, documents characterization and measurement reports, and improves and optimizes design margins.
- Develops test structures, electrical analysis methodology and verification plans to address challenges.
- Performs measurements to characterize/correlate to verify electrical specification after design and correlate back to pre-silicon analysis/estimations.
- Documents and provides implementation guidelines to the end customers as part of the platform design guide.
- Collaborates with IP design teams and silicon integration teams to ensure the IP and SoC designs maximize the platform level solution space to meet targeted product landing zone requirements and minimize quality degradation (e.g., attenuation, crosstalk, jitter, power noise) and cost.
- Your responsibilities will include but are not limited to: Perform various technical, operational, and project-related activities in PG Lab.
- Prepare and setup collaterals required for measurement.
- Deliver correlation data between simulation and measurement results.
- Setup model and run the simulation on signal integrity, power integrity and radio frequency interference (RFI).
- Setup and conduct lab measurements on signal quality and integrity, power integrity and radio frequency interference (RFI).
Requirements
- to be initially considered.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Experience listed below would be obtained through a combination of your schoolwork/classes/research and/or relevant previous job and/or internship experience.
- Bachelor's degree in science/engineering (Electronics/Electrical/Computer Engineering/Microelectronics/Telecommunications, or related field).
- Strong verbal and written communication skills, safety minded, and a good team player.
- Excellent problem-solving skills, critical thinking skills, and ability to rapidly adjust to changing priorities.
Nice to Have
- Ex-intern of Intel, exposed to lab work or SI, PI or RF and EMC simulation before.
- Proficiency with computer hardware and software.
- Knowledge and/or experience with data extraction, analysis, visualization techniques, and developing programs to integrate and manage data.
Sourced directly from Intel’s career page
Your application goes straight to Intel.
Opens intel.wd1.myworkdayjobs.com in a new tab
Specialisation
Open roles at Intel
652 positions
Job ID
/job/Malaysia-Penang/Graduate-Talent--Client-System-Electrical-_JR0284956
Get matched to roles like this
Upload your resume once. We’ll notify you when matching roles open up.
Join talent pool — freeSimilar Other roles
Samsung Semiconductor
Technical Account Manager, DRAM Business Enablement
San Jose, California, United States|Other
Samsung Semiconductor
Senior Engineer, Connectivity Software, UWB - WIFI
San Jose, California, United States|Other
Micron Technology
SSD Hardware Architect
2 Locations|Other
Micron Technology
PCB Layout Designer
Boise, ID - Main Site|Other