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About This Role
- Join Intel and build a better tomorrow.
- Our exciting vision: Extend computing technology to connect and enrich the lives of every person on earth.
- Join us as we create the next generation of technologies that will shape the future for decades to come.
- The Wafer Packaging Manufacturing (WPM) organization owns a crucial part of semiconductor wafer processing, testing, and die-to-wafer assembly.
- In addition to traditional product types, we drive Intel's advanced packaging strategy - bringing compelling capabilities to market and enabling large-scale AI computing.
- Within WPM, the fab module engineer role is multifaceted.
- The ideal candidate will have a passion for equipment and process optimization with the goal of developing a robust manufacturing process module.
- You will be responsible for owning all aspects of one or more of our factory's 300mm toolsets in the segment responsible for thick metal/via layers, bumping, reflow, thinning, and backside metallization.
- Sustaining responsibilities will include safety, tool health and matching, process health and matching (process control systems), excursion prevention and response, and enabling a diverse range of product types to run efficiently through the line.
- You will work with partners in other geographies to ensure the factory network consistently and cohesively delivers high-quality, high-confidence products for our customers.
- You will be responsible for delivering Model of Record tool performance and drive continuous improvement toward tool availability, cycle time, defect density, and cost.
- Our organization supports the full process/product lifecycle for this segment, inclusive of early development, ramp readiness, ramp, and long-term high-volume manufacturing.
- Thus, your responsibilities may include elements of module-level development.
- Examples include defining roadmaps to meet process/product requirements, driving equipment configuration changes, designing and conducting experiments, materials development and selection, and characterization of defect modes and integrated issues/marginality with proposals to resolve them.
- Module engineers must solve problems utilizing formal education, self-driven knowledge and upskilling, statistical knowledge, and effective problem-solving tools/methods.
- Additionally, engineers must build lasting capability for the module through training others; robust documentation; cogent analysis and presentation of data; thorough transfer to other sites; and hardening systems for safety, quality, output, and cost.
- The ideal candidate will demonstrate the following traits: They are capable of working in a high-performing culture with high expectations, execution with urgency, and personal ownership.
- They are data-driven and are motivated to solve problems, independently and in a group setting, with high commitment to task.
- They thrive in a dynamic and ambiguous environment.
- They possess excellent teamwork and leadership skills with outstanding communication, interpersonal, and influencing skills.
- Working with us is an opportunity to transform technology and create a better future.
- We foster a collaborative, supportive, and exciting work environment, where the brightest minds come together to achieve exceptional results.
- We offer competitive salary and financial benefits as well as programs that promote health and well-being.
- We strive for a more connected and intelligent future, and we are excited for you to join us in that mission.
Requirements
- to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor.
Requirements
- Bachelor's Degree in an Engineering STEM related field (e.g., Electrical Engineering, Chemistry, Chemical Engineering, Mechanical Engineering, Materials Science, Physics, Robotics, Molecular and Nanomaterials, Nanoengineering). 6+ years semiconductor Engineering (fab or OEM vendor) experience.
Nice to Have
- Advanced degree in related field (as above) or 10+ years semiconductor experience (as above) are highly desirable.
- Knowledge of statistics and experimental design and the skills to apply that knowledge to tool matching, tool qualification, and process development.
- Strong data analysis and presentation acumen.
- Strong technical and troubleshooting skills.
- Ability to work across organizational boundaries including module process engineering, manufacturing, integration and yield.
- Excellent teamwork and leadership skills with outstanding communication, interpersonal, and influencing skills.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $120,860.00-231,670.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
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Specialisation
Open roles at Intel
712 positions
Job ID
/job/US-Oregon-Hillsboro/Fab-C4-Bumping-Module-Engineer_JR0282698
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