Defect Characterization Low Yield Analysis Engineering Technician

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Performs material and defect characterization to support backend package assembly and substrate manufacturing yield improvement.
Conducts physical and technical failure analysis to identify defects causing inline yield loss and determines root cause using advanced characterization techniques.
Prepares samples and operates laboratory tools including SEM, EDX, X-ray, ion mill, mechanical polisher, and FIB to analyze defects.
Documents and communicates findings through technical reports and presentations to engineers, operators, and management, and provides recommendations for process, material, or equipment improvements.
May acts as characterization tool owner, responsible for daily tool operation and maintenance, coordinating repairs and preventive maintenance with FSEs, and managing consumables and supplies.
Supports backend shift operations by characterization defects with yield excursions, and providing technical guidance and training to peers and line operators.
Ensures compliance with safety, quality, and Stop-the-Job (STJ) requirements while contributing to continuous improvement efforts.

High School diploma with 10+ years of relevant experience, or AA/AS degree with 6+ years of relevant experience, or Bachelor's degree with 4+ years of relevant experience.
Preferred Qualifications Hands-on experience in failure analysis and defect characterization for semiconductor packaging or substrate manufacturing.
Experience working in a high-volume manufacturing or laboratory environment.
Experience operating characterization tools such as SEM, EDX, X-ray, mechanical polisher, Keyence, CSAM/TSAM, delid, and ion mill.
Strong skills in data analysis, technical reporting, and root cause determination.
Ability to work independently on backend or off-shifts.
Working knowledge of package assembly processes and yield loss mechanisms.
Tool ownership experience, including daily tool maintenance, troubleshooting, and coordination with FSEs.
Proficiency in advanced failure analysis techniques such as cross-sectioning, delayering, SEM/X-ray analysis, and FIB.
Proven ability to provide technical training and collaborate effectively with cross-functional teams.
Demonstrated passion for continuous learning and manufacturing excellence.

We offer a total compensation package that ranks among the best in the industry.
It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
Find out more about the benefits of working at Intel .
Annual Salary Range for jobs which could be performed in the US: $70,670.00-116,640.00 USD (Hourly Role) The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

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