Customer Yield Engineer – Foundry Engineering (Taiwan)

About This Role

• As a Customer Yield Engineer based in Taiwan within Intel Foundry Customer Engineering, you will function as yield interface for assigned foundry customers in Taiwan, providing close, direct yield support.
• The role serves as a critical local extension of Intel's Customer Engineering organization, ensuring fast execution and clear communication across regions.
• You will work in close alignment with the Yield DRI and cross-functional factory teams in Intel FAB, supporting yield analysis, data driven issue assessment and recovery actions across technology development, manufacturing ramp, and high-volume production.
• In parallel, you will manage and support OSAT activities for Intel-owned engineering (ENG) material, ensuring yield integrity, rapid learning cycles, and alignment between FAB and OSAT.
• This position requires deep technical expertise in yield and process engineering, strong data-driven critical thinking skills, and the ability to collaborate effectively with customers, suppliers, and global internal teams.
• Key Responsibilities • Function as the Taiwan-based point of contact for customer yield, providing day-to-day yield engagement and follow-up with Intel Foundry Customers. • Work in close partnership with the Yield DRI and factory teams in Intel Foundry FAB to align on root cause, recovery plans, and execution priorities. • Manage and support OSAT yield activities for Intel-owned ENG material, including yield monitoring, WIP management and ENG debug activities. • Collaborate with cross-functional engineering teams (device, integration, yield, lithography, etch, thin films, test) to maintain process stability and deliver technical solutions. • Identify process weaknesses and manufacturing tool issues using big data, statistical analysis, and advanced analytical methods. • Proactively identify yield risk, variability, and systemic trends, escalating issues with clear impact assessment and recommended actions. • Communicate yield status, risks, and recovery plans clearly to both technical teams and customer management when necessary.
• Technical Scope • Yield, defect, and parametric data analysis, including data extraction, validation, statistical analysis, and visualization. • 300mm advanced logic wafer fabrication processes and yield behavior across development, ramp, and production. • Assembly and test fundamentals, OSAT process flows, and fab-to-OSAT yield interfaces. • Design-for-test concepts, fault isolation, and yield learning loops. • Semiconductor device physics, materials, and electrical performance.