Opens intel.wd1.myworkdayjobs.com in a new tab
About This Role
- The Role and Impact As a Product Packaging Engineer, you will be at the forefront of designing and developing innovative packaging solutions that accelerate Intel's product delivery to a global customer base.
- This role places you at the intersection of engineering innovation and sustainability, ensuring Intel's products are safely transported while minimizing environmental impact.
- You will collaborate across diverse teams, including manufacturing, regulatory, logistics, and supply chain, to meet operational goals and drive continuous improvement.
- Your contributions will directly influence Intel's ability to deliver high-quality products efficiently, making you an essential part of our mission to shape the future of technology.
- Key Responsibilities Design, develop, and qualify packaging solutions and materials that meet product, regulatory, and environmental requirements.
- Lead packaging development efforts, including creating artwork, prototypes, and detailed specifications.
- Collaborate with cross-functional teams to ensure packaging solutions align with manufacturing, logistics, and supply chain needs.
- Identify and implement cost-saving measures and processes to enhance efficiency, reduce waste, and promote sustainability.
- Conduct risk analyses to ensure compliance with regulations and Intel's high-quality standards.
- Partner with cross-organizational teams on SKUs, labeling, branding, and bills of material for product distribution.
- Evaluate and qualify vendors to ensure scalability and high-quality manufacturing of packaging solutions.
- Technical knowledge and firsthand experience are critical for effective integration of cross functional efforts including Assembly Process technology, Package assembly Design Technology, design services, statistical model-based analysis and Yield and package reliability analysis Engages with customer and Drives programs to satisfy foundry customer needs. -Create and maintain detailed technical specifications to ensure consistent and clear documentation.
- Behavioral Skills: Strong communication and collaboration skills with the ability to work effectively across internal teams, vendors, customers, and cross-functional stakeholders.
- Strong analytical and problem-solving skills.
- Ability to manage multiple priorities in a fast-paced technical environment.
- Demonstrated ability to research, develop, and drive innovative technical solutions.
- Strong organizational and documentation skills.
Requirements
- Bachelor’s degree in Engineering, Material Science, Physics, Chemistry, or a related technical field. 6+ years of experience with a Bachelor’s degree, 2+ years with a Master’s degree, or a PhD with relevant academic/research experience in semiconductor industry processes, semiconductor packaging, optics, or optical packaging technologies.
- Additional Qualifications for Consideration: Knowledge of Design for Manufacturing (DFM) principles.
- Experience with semiconductor packaging assembly and production processes.
- Experience with optical packaging technologies and semiconductor manufacturing environments.
- Experience performing data analysis, statistical analysis, yield analysis, or package reliability analysis.
- Experience working in cross-functional engineering and manufacturing environments.
- Join our team and make an impact on Intel's packaging innovation and sustainability efforts.
- Apply now to shape the future of technology and leave your mark on a global scale.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $164,470.00-232,190.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
Your application goes straight to Intel.
Opens intel.wd1.myworkdayjobs.com in a new tab
Specialisation
Open roles at Intel
713 positions
Job ID
/job/US-Arizona-Phoenix/Assembly-Packaging-Technical-Integrator---Intel-Foundry-Services-MAG_JR0284317
Get matched to roles like this
Upload your resume once. We’ll notify you when matching roles open up.
Join talent pool — freeSimilar Other roles
Micron Technology
SR ENGINEER, FE GLOBAL MANUFACTURING ENGINEERING
2 Locations|Other
Micron Technology
Process Integration Engineer (BEOL)
Hiroshima - Fab 15, Japan|Other
Micron Technology
Technician - RDA Shift Process
Fab 10N/X, Singapore|Other
Micron Technology
F16N_HVM _ Production/ Equipment/ Process Engineer
Miaoli - Tongluo, Taiwan|Other