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About This Role
- As a Module Development Engineer, you will be at the forefront of Intel's advanced packaging technology development, driving both high-volume manufacturing and the enablement of future technologies.
- In this role, you will lead the plating process development, optimize equipment solutions, material & chemical selection, and perform feasibility studies to meet device specifications.
- Your work will directly contribute to Intel's innovation in technology roadmaps, enabling cutting-edge device architecture and advancing semiconductor manufacturing capabilities.
- By collaborating with cross-functional teams and external suppliers, you will ensure the creation of robust, scalable solutions that position Intel as a leader in the semiconductor industry.
- The primary responsibilities for this role will include, but are not limited to: Drive technology development and enablement for current and future nodes for electroplating needs.
- Lead and drive advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
- Design, execute and analyze experiments to improve electroplating process.
- Develop technology roadmaps to guide future manufacturing needs and push industry standards forward.
- Collaborate with equipment and material suppliers to design and implement innovative process technologies.
- Closely engage with equipment and chem suppliers for better process outcomes.
- Optimize production efficiency and manufacturing techniques, while improving output for existing products.
- Utilize data analytics and statistical methods to provide insights for continuous process improvements.
- Identify and implement modifications for equipments to enhance operational efficiency.
- Lead path-finding activities and innovative process development to enable new device architectures.
Requirements
- Minimum qualifications are required to be initially considered for this position.
- Master’s degree with 6+ years of relevant experience, or PhD with 4+ years of experience in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Chemistry, Physics, or a related STEM discipline. 3+ years of experience in Electrochemical Plating processing, fab process development, and/or advanced packaging technology.
- Advanced knowledge in process development methodology, statistical process control, research and development, and manufacturing process improvement.
Nice to Have
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Experience in advanced packaging, RDL-based packaging, or ultra-fine pitch solder connections.
- Proven track record in leading programs from strategy formation through high-volume production and sustaining.
- Recognized technical leadership and capability to develop solutions to complex engineering problems.
- Strong collaboration skills with decision-makers across various functional areas such as yield and operations.
- We are looking for innovative and disciplined individuals passionate about advancing semiconductor technology.
- Apply today to become part of Intel's mission to shape the future of technology.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $155,520.00-219,550.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
Your application goes straight to Intel.
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Specialisation
Open roles at Intel
712 positions
Job ID
/job/US-Oregon-Hillsboro/Advanced-Packaging-TD-Plating-Module-Engineer_JR0281699
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