Advanced Packaging Substrate Supplier Enablement Lead

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Lead supplier enablement for next generation substrate technologies within APTD.
You will drive strategic supplier readiness, accelerate technology maturation, and scale manufacturing capability to support Intel's high performance and AI centric product roadmap.
Key Responsibilities Lead global substrate supplier development, readiness, and factory ramp execution.
Drive qualification of new capacity, including tool installs, process capability, and line/factory maturity.
Influence supplier technology roadmaps and investments to align with program and long range planning needs.
Manage risks, set clear expectations, and ensure accountability across supplier and cross functional teams.
Strengthen strategic partnerships to enhance supply resilience and accelerate innovation.
Support occasional international travel for on site supplier readiness and critical milestone execution.

are required to be initially considered for this position.
Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Bachelor's degree in engineering, physics, materials science, or a related field, and 6+ years of relevant experience; or Master's degree in engineering, physics, materials science, or a related field, and 4+ years of relevant experience; or PhD degree in engineering, physics, materials science, or a related field, and 2+ years of relevant experience.
Relevant experience should include advanced packaging, substrates, or semiconductor manufacturing.

Proven ability to thrive in high-ambiguity environments and deliver results under pressure.
Leadership in supplier management or technology enablement; and the ability to drive alignment and execution across global teams.
Strategic mindset with the ability to align technical vision to organizational goals.
Experience mentoring and developing technical talent.
Enthusiasm for innovation, continuous learning, and contributing to Intel's technical leadership.
Demonstrated capability in structured problem solving in complex, fast-paced environments.
Extensive experience in driving yield improvements and managing process integration challenges.
Apply now to be part of Intel's journey in redefining technology and shaping the future of manufacturing.

We offer a total compensation package that ranks among the best in the industry.
It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
Find out more about the benefits of working at Intel .
Annual Salary Range for jobs which could be performed in the US: $140,830.00-269,950.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

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