Engineer, Tapeout Engineering

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What You'll Do

  • Support semiconductor mask data preparation and tapeout activities, including layer generation and integration of OPC and ORC processes.
  • Collaborate with cross ‑ functional teams to support pre ‑ tapeout design flows, frame generation, and end ‑ to ‑ end tapeout schedules to meet customer requirements.
  • Assist in problem solving, planning, and testing across the tapeout and mask build flow to ensure accurate and on ‑ time photomask delivery.
  • Participate in continuous improvement and automation initiatives to enhance tapeout and mask data preparation workflows.
  • Assist in evaluation, testing, and adoption of new software tools and workflow enhancements.
  • Work within Agile delivery teams to support embedded quality engineering activities during sprint ‑ based development.
  • Collaborate with Product Owners and Business Analysts to refine user stories and acceptance criteria for clarity, completeness, and testability.
  • Design and execute functional and end ‑ to ‑ end test cases; support System Integration Testing (SIT) and User Acceptance Testing (UAT).
  • Validate positive and negative flows, edge cases, and basic non ‑ functional requirements such as performance and security awareness.
  • Identify requirement gaps, inconsistencies, and risks early, providing technical feedback under senior guidance.
  • Log, track, and triage defects; contribute to root cause analysis, quality metrics, and continuous improvement initiatives.
  • Provide technical support to field engineering, customer engineering, and process owners as needed.
  • Proactively anticipate customer needs and assist in capacity planning to support tapeout requirements.
  • Perform all activities in compliance with Environmental, Health, Safety, and Security (EHS&S) requirements and programs.
  • Collaborate on additional projects or assignments as required by the organization.
  • Required Qualifications Bachelor’s Degree in Engineering, Computer Science, Electronics, Electrical Engineering, or a related technical discipline.
  • Experience or strong interest in semiconductor manufacturing flows, mask data preparation, or tapeout processes.
  • Foundational knowledge of photomask generation, OPC/ORC concepts, and pre ‑ tapeout design flows.
  • Exposure to Agile or DevOps environments, with understanding of sprint ‑ based development and quality engineering practices.
  • Experience designing and executing functional and end ‑ to ‑ end tests, defect tracking, and test documentation.
  • Familiarity with software validation, workflow automation, or digital transformation initiatives is a plus.
  • Strong analytical and problem ‑ solving skills with attention to detail and process quality.
  • Effective communication skills with the ability to collaborate across engineering, product, and manufacturing teams.
  • Ability to work effectively in evolving environments and adapt to changing priorities.
  • We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard.
  • As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.
  • All offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.
  • Information about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia

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Specialisation
Open roles at GlobalFoundries
524 positions
Job ID
/job/Singapore/Engineer--Tapeout-Engineering_JR-2504311

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