SR. Business Development Manager – China Region (IP: DSP, CPU)

What You'll Do

• Business Development & IP Sales Drive IP licensing growth in China, with a strong focus on Tensilica DSP and CPU technologies.
• Engage with SoC teams in automotive, AR/VR, mobile, smart speakers, TWS, and broader consumer markets .
• Identify and qualify new business opportunities, expand existing accounts, and manage the full sales cycle.
• Understand customer architecture requirements, future roadmaps, and competitive offerings to position Tensilica IP effectively.
• Work closely with China sales teams to develop and execute regional account strategies. 2.
• Software Partner Ecosystem Management Build, develop, and nurture relationships with key software vendors , including: AI/ML algorithm developers Audio/voice/ANC/beamforming software vendors Vision and XR software developers Automotive middleware and safety‑related software providers Advocate Tensilica DSPs by driving: Partner onboarding Technical enablement Performance optimization Joint solution and reference design development Expand the breadth of use cases supported on Tensilica DSPs, including: AI inferencing Audio/voice processing Sensor fusion XR/AR acceleration Always‑on, low‑power workloads 3.
• Collaboration with China Sales & FAE Teams Work hand‑in‑hand with the China sales organization to coordinate account strategies and engagement plans.
• Partner closely with FAE teams to: Support technical evaluations Manage benchmarking activities Drive proof‑of‑concept engagements Resolve technical blockers that influence purchasing decisions Provide feedback from customers and partners to guide product planning and roadmap decisions. 4.
• Market Intelligence & Strategic Planning Develop China‑specific go‑to‑market strategies for automotive and consumer segments.
• Monitor industry trends, emerging workloads, regulatory standards, and local ecosystem shifts (software and hardware).
• Represent the company at China industry conferences, partner workshops, customer summits, and semiconductor forums.
• Qualifications Required Bachelor’s or Master’s in Electrical Engineering, Computer Engineering, or related discipline. 10+ years of experience in semiconductor IP, DSP/CPU/NPU technologies, SoC design, embedded software, or related business development roles.
• Strong technical understanding of DSP architectures, signal processing, embedded systems, and AI workloads.
• Proven success selling semiconductor IP or building technical business engagements in China.
• Familiarity with software ecosystems in audio, voice, AI/ML, AR/VR, and automotive domains .
• Excellent communication, negotiation, and relationship‑building skills.
• Ability to travel within China and internationally.
• Preferred Direct experience with Tensilica DSPs or similar configurable DSP architectures.
• Existing relationships with: China automotive SoC vendors Smartphone/IoT/CE chipmakers AR/VR and edge‑AI solution developers Leading software algorithm partners Understanding of heterogeneous compute architectures, low‑power SoC design, or automotive functional safety (e.g., ISO26262).
• We’re doing work that matters.
• Help us solve what others can’t.