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What You'll Do

  • Develop, validate, and deploy 3D-IC system-level design planning & physical implementation flow.
  • Design flow automation for 3D-IC system-level analysis & physical verification and verify simulation results.
  • Work closely with cross-functional teams, project managers, and customers to explore, develop and drive 3D-IC implementation, RC extraction, analysis, and verification flow enablement.
  • Job Requirements: Solid working knowledge and hands-on experience in synthesis, block, or top-level physical PnR implementation, and signoff flows.
  • Strong programming and scripting skills in Tcl and Shell.
  • BS or MS degree in EE, EECS, or CE with 3 years of engineering experience in the semiconductor industry.
  • Excellent skills in problem-solving, written and verbal communication, excellent organization skills, and highly self-motivated.
  • Independent, self-starter who can work across a worldwide organization and customer base.
  • We’re doing work that matters.
  • Help us solve what others can’t.

Sourced directly from Cadence Design Systems’s career page

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Specialisation
Open roles at Cadence Design Systems
658 positions
Job ID
/job/HSINCHU/Product-Engineer-II_R52980

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