Design Engineering Architect

What You'll Do

• Work on test chip package design SI/PI optimization and verification.
• Work on evaluation board design optimization for best SI/PI performance.
• Provide extracted and measured channel models for chip designers in the R&D team.
• Help with package and PCB SI/PI design guidelines and customer support on SI/PI related inquiries.
• Review customer package and board designs and simulation results.
• Help with providing feedback to customers to ensure best possible performance of our IP in their ASIC.
• Work on link performance simulations using S-parameter channel models and IBIS-AMI behavioral models.
• Help with SI/PI related debug of test chips or customer ASICs in the lab.
• Position Requirements: M.S. or Ph.D.
• Electrical Engineering (or similar degree) 15+ years of experience preferably working with high speed SerDes and PHYs Good understanding of high speed SerDes architecture Hands on lab experience with instruments like high speed oscilloscopes, TDRs, VNAs, spectrum analyzers, etc.
• Fluent with using 3D and 2.5D extraction tools like Sigrity Clarity/PowerSI or Ansys HFSS/SIwave Experience with IBIS-AMI model simulations Experience with simulation result to lab measurement correlation Good understanding of PCB and FCBGA design rules and requirements Strong debugging and problem-solving skills Excellent communication and presentation skills to effectively communicate with both customers and internal stake holders We’re doing work that matters.
• Help us solve what others can’t.