Substrate Engineer

About This Role

• JD: Responsible for working with Broadcom's IC substrate subcontractors to manage and resolve issues relating to packaging, manufacturing, yield, quality, and delivery of high volume semiconductor devices.
• Responsible for NPI activity, risk assessments, process improvement & development and production engineering support of high volume IC substrate manufacturing.
• Work with Broadcom internal cross functional engineering teams resolve issues with interactive nature; work on newly developed packaging technology and drive towards high volume manufacturing maturity Responsible for new product pre-production engineering activity and drive improvements in process and visual mechanical yields, cycle time.
• Take on site to site standardizations in Best Known Methods, and verification on compliance towards Broadcom requirements Drive capability enhancement and cost reduction projects JR: Bachelor Degree in an engineering discipline (Mechanical, Manufacturing, Material Science, Chemicalor Electrical). 8 years' experience in IC substrate manufacturing technologies and processes.
• Direct process and operational experience in a substrate manufacturing operations line is required.
• Expertise in ABF substrate interactions with Ball Grid Arrays, flipchip; laminate substrates interactions with die attach, wirebonding, molding, flipchip attach, singulation, packaging materials is required.
• Track record of good achievements managing substrate technical specifications that impact the downstream margins of assembly processing.
• Direct process and operational experience in manufacturing environment Experience in component quality interactions with SMT processibility is not a pre-requisite, but will be favorable Proven ability to manage and coordinate complex activities across multiple groups including operations, quality, business units, suppliers, marketing, customers.
• Experience with managing activities with packaging subcontractors and driving resolution of manufacturing issues.
• Demonstrate leadership in working within different internal functional groups to manage issue containment and drive the best path forward.
• Thorough knowledge of problem solving methodologies and failure analysis techniques.
• Must demonstrate the ability to quickly make assessments of risks and take the necessary steps in managing escalations.
• Demonstrate good communication skills in problem resolution.
• Have a very good command on spoken and written English, Fluent in Mandarin Willing to travel throughout Asia to support manufacturing locations.
• We will also consider qualified applicants with arrest and conviction records consistent with local law.
• If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.