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About This Role

  • Central technical liaison / Primary interface between internal team (RND/NPI/Packaging/QA) and wafer sort CM.
  • Work closely with wafer sort CM on process development / improvement and process defect related activities.
  • Managing other wafer sort CM related activities.
  • Able to work independently with minimum supervision and set appropriate priorities to ensure timely delivery.
  • Minimum Requirement: Bachelor/Master/PhD degree (or equivalent qualification) in Electrical/Electronic engineering.
  • Minimum 5 years (preferably 8 years)working experience in wafer foundry / wafer sort process related fields.
  • In-depth process knowledge on process like bumping, dicing, backgrind, tape & reel… Able to speak fluently in Chinese & English.
  • Skills on data analysis / programming / AI are added advantages.
  • We will also consider qualified applicants with arrest and conviction records consistent with local law.
  • If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Sourced directly from Broadcom’s career page

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Broadcom

Malaysia-Penang B 1 & 2

Specialisation
Open roles at Broadcom
407 positions
Job ID
/job/Malaysia-Penang-B-1--2/R-D-Engineer-Hardware_R025741-1

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