Opens broadcom.wd1.myworkdayjobs.com in a new tab
About This Role
- Central technical liaison / Primary interface between internal team (RND/NPI/Packaging/QA) and wafer sort CM.
- Work closely with wafer sort CM on process development / improvement and process defect related activities.
- Managing other wafer sort CM related activities.
- Able to work independently with minimum supervision and set appropriate priorities to ensure timely delivery.
- Minimum Requirement: Bachelor/Master/PhD degree (or equivalent qualification) in Electrical/Electronic engineering.
- Minimum 5 years (preferably 8 years)working experience in wafer foundry / wafer sort process related fields.
- In-depth process knowledge on process like bumping, dicing, backgrind, tape & reel… Able to speak fluently in Chinese & English.
- Skills on data analysis / programming / AI are added advantages.
- We will also consider qualified applicants with arrest and conviction records consistent with local law.
- If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Sourced directly from Broadcom’s career page
Your application goes straight to Broadcom.
Opens broadcom.wd1.myworkdayjobs.com in a new tab
Specialisation
Open roles at Broadcom
407 positions
Job ID
/job/Malaysia-Penang-B-1--2/R-D-Engineer-Hardware_R025741-1
Get matched to roles like this
Upload your resume once. We’ll notify you when matching roles open up.
Join talent pool — freeSimilar Other roles
Samsung Semiconductor
Principal Engineer, RFIC
San Jose, California, United States|Other
Micron Technology
Engineer, Production
Tainan, Taiwan|Other
Micron Technology
Senior data scientist
Fab 10A, Singapore|Other
Micron Technology
Member of Technical Staff (MTS), Machine Learning, SMAI
Fab 10A, Singapore|Other