ChipFab Product/Process Engineer

About This Role

• Job Description New Facilities & Production Ramp-Up: Lead the team to ramp-up new facilities, ensuring aggressive capacity scaling are consistently achieved within strict project timelines.
• New Equipment, Process & CM Qualification: Lead the cross functional team in the evaluation, qualification, and strategic onboarding of new Contract Manufacturing (CM) partners, new equipment, and manufacturing processes to ensure a seamless transition into mass production.
• New Product Transfer & Technical Ownership: Drive for seamless transition of products from New Product Introduction (NPI) to High-Volume Manufacturing (HVM), acting as the first line of technical defense for all product-related issues on the factory floor.
• Yield Stabilization & Enhancement: Monitor production yields across contract manufacturers.
• Proactively identify yield issue such as Low Yield Triggered , On-Hold Rate, Rework Rate and drive for improvement.
• Line Sustaining, drive for process yield Improvement : Resolve daily CM engineering, production, and quality issues by implementing robust corrective actions and driving continuous process improvement initiatives.
• Product Costing Management: Oversee product cost analysis and proactively identify opportunities for cost reduction through process optimization, yield enhancement, and cycle time improvements.
• Data-Driven Engineering Analysis: Drive to monitor CM performance metrics and troubleshoot complex manufacturing deviations utilizing advanced analytical software (e.g., JMP).
• Customer Quality Assurance: Conduct rigorous on-site quality audits at partner facilities to enforce strict adherence to Standard Operating Procedures (SOPs), Process Control Plans (PCPs), and overarching quality standards.
• Drive Contract Manufacturers (CMs) to promptly resolve customer quality issues by leading root cause investigations, implementing robust corrective actions (CA), and tracking their long-term effectiveness.
• Requirement Bachelor’s or Master’s degree in Mechanical/Electrical & Electronics Engineering, Semiconductor Manufacturing, Fiber Optics/Photonics Product Engineering, or a related highly technical field.
• Minimum 10+ years of hands-on engineering and leadership experience in backend Indium Phosphide InP wafer processing (from wafer to chip-out) or complex semiconductor/photonics manufacturing.
• Familiarity with Bar Processing such Bar Stacker/unstack, Scribe & Break, AOI, and Pick & Place will be an added advantage.
• Strong leadership capabilities with a proven history of managing remote teams, driving cross-functional initiatives, and successfully leading new facility or production line ramp-ups.
• Extensive expertise in product and process yield improvement methodologies, complex problem-solving, and equipment qualification.
• Highly proficient in JMP software, with a strong capability to leverage it for complex statistical data analysis and critical decision-making.
• Excellent communication, negotiation, and project management skills, with the ability to influence external partners and internal stakeholders effectively.
• We will also consider qualified applicants with arrest and conviction records consistent with local law.
• If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.