Advanced Package Technology Engineer

About This Role

• As part of WW ASIC product development team, this individual will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers and is responsible for developing cost effective high performance, advanced custom package solutions achieving signal integrity, thermal, structural reliability, substrate fab/package assembly design rules & project schedule requirements. • 2.5D & 3D is cutting edge package technology with BRCM’s needs pushing the technology limits.
• Job Scope (Advanced Package Technology Engineer) – Provide deeper expertise in 2.5D / 3D technology ; current and future customer engagement on technology needs & updates, consolidation of requirements and drive towards unified solution. – Lead in identification, development & qualification; program management with external assembly partners – Lead in memory supplier(s) engagement to define technology and quality requirements. – Interface with other technical teams (DI, Pkg Design, Test Dev) etc. as part of Cross Functional Team. – Support new design wins, NPI and volume ramps. – Develop alternate sourcing & qualification.
• Basic : Master's Degree in Mechanical / Electrical / Electronics Engineering with 6+ years of relevant experience in developing cost effective, high performance (speed, density, pin count, thermal & reliable), single & multi-chip, large, complex, custom & fine pitch flip chip packaging solution with advanced multi-layer ceramic / organic substrates & Interposers; Standard & thermally enhanced fine pitch leaded & BGA wire bond & wafer level packaging solution; or PhD with 3 + years of relevant experience Specific : 4~6 years Hands On experience in 2.5D / 3D Development; In-depth Know-how of Advanced Silicon fab, Bump, Interposer, substrate & assembly processes, materials & supplier selection, BOM definition, thermal and mechanical interactions.
• Others: – Sound knowledge of & hands on experience in advanced, prevailing and emerging silicon, package & substrate technologies, bumping and assembly processes, design rules, failure analysis tools and techniques, materials and equipment, applicable industry standards, regulations & quality systems. – Good team player with project management, analytical, problem-solving and interpersonal skills.
• Must be self-driven, flexible and agile, result oriented individual.
• Ability to develop concepts into structured projects, generate new and innovative solutions to complex problems and handle multiple programs concurrently. – Hands-on experience of use of modelling (Thermal & Mechanical) & Sub / PCB Design CAD tools (APD, AutoCAD, Solidworks etc ) for design optimization. – Sound knowledge of advanced node silicon fabrication, PCB technologies and board assembly processes, applicable industry standards, quality systems and regulations. – Communicate extensively with internal and external team members, customers in various global locations and may require travel from time to time.
• Additional Job Description: Compensation and Benefits The annual base salary range for this position is $120,000 - $192,000 This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
• Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time.
• The company follows all applicable laws for Paid Family Leave and other leaves of absence.
• We will also consider qualified applicants with arrest and conviction records consistent with local law.
• If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.