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Requirements

  • Master’s degree or above in Mechanical Engineering, Microelectronics, Electronics Packaging, Material Science, Optical Engineering, or related fields Familiar with packaging technologies (PCBA, module assembly, optoelectronic co-packaging, precision bonding, etc.), with practical project experience preferred.
  • Proficient in mechanical design software (such as SolidWorks, Creo) with capabilities in structural design and precision assembly analysis Knowledge in IC package reliability requirements, failure analysis techniques, assembly process issues, etc.
  • Prior industry working experience or internship in IC package, power module, or co-packaged optical module assembly would be distinct advantage.
  • Hand-on experience with thermal simulation tools (COMSOL, Ansys Icepak, Flotherm, etc.), capable to analyze thermal distribution, temperature drift impacts, and cooling solutions.
  • Experience with optical design tools (such as Zemax, CodeV, Lumerical, FDTD) and being capable of optical path design, coupling simulation, and tolerance analysis is a plus.
  • Basic understanding of silicon photonics platforms, optical devices (laser, modulator, detector, multiplexer, etc.), and coupling methods is a plus.
  • Proficient in English.
  • For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S.
  • Department of Commerce - Bureau of Industry and Security and/or the U.S.
  • Department of State - Directorate of Defense Trade Controls.
  • As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.
  • We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.
  • Job Req Type: Graduate Job Required Travel: Yes, 10% of the time

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Analog Devices

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/job/China-Shanghai-Pudong-ZuChongzhi/Packaging-Engineer_R260588

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