Sr. Wire Bond Equipment Engineer

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Nice to Have

  • TOEIC >600 or other English comprehensive certification Experience with wire bonder, eg K&S Rapid; ASM AERO...etc Knowledge of automation, SECS/GEM, and equipment data analysis.
  • Six Sigma Green Belt or equivalent certification.
  • More information about NXP in Greater China... #LI-2370

Sourced directly from NXP Semiconductors’s career page

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Specialisation
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Job ID
/job/Kaohsiung/WB-Equipment-Engineer_R-10065779

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