Sr. Engineering Technician - Packaging Lab

Nice to Have

• Minimum educational requirement is a High School Diploma or GED Experience with analytical test tools such as: Acoustic Imaging (C-SAM) Dynamic Mechanical Analysis (DMA) Thermal Mechanical Analysis (TMA) Nanoindentation Testing Four-Point Bend Testing Experience with chemical analysis techniques and laboratory testing methods.
• Previous experience in the semiconductor industry, materials characterization, or reliability testing.
• Knowledge, Skills, and Abilities Strong attention to detail and commitment to data accuracy.
• Ability to interpret technical procedures and engineering documentation.
• Experience working with complex testing systems and laboratory equipment.
• More information about NXP in the United States...
• NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law.
• In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals. #LI-97b2