Sr. Die Bond Process Engineer

Qualifications

• At least 2 years of working experience in semiconductor manufacturing, preferably as a Die Attach Process Engineer.
• Master’s degree or above in engineering-related disciplines, such as Electrical Engineering, Mechanical Engineering, Materials Science, or Chemical Engineering.
• Technical and Analytical Skills: Solid knowledge of process control, yield analysis, defect reduction, and continuous improvement methodologies.
• Candidates with a statistics-related background are preferred, with the ability to apply data analysis techniques to process monitoring and improvement (e.g.
• SPC, Cp/Cpk, GR&R, MSA).
• Hands-on experience with FDC (Fault Detection & Classification) and ADC (Automatic Defect Classification) applications, capable of utilizing process and equipment data for abnormal detection, trend monitoring, and early warning.
• Experience in process automation applications, able to support system- or equipment-level automation projects to enhance process control and reduce manual operation risks.
• Quality and Customer Interface Experience: Experience in customer complaint handling and root cause analysis, familiar with structured problem-solving methodologies such as 8D, 5 Why.
• Ability to work effectively with cross-functional teams (Process, Quality, Equipment, and Suppliers) to drive corrective and preventive actions.
• Communication Skills: Good written and verbal English communication skills, capable of effective interaction with customers, suppliers, and internal teams.
• English proficiency equivalent to TOEIC 600 or above.
• Systems and Manufacturing Knowledge Ability to leverage system and automation data for process tracking, lot history review, abnormal analysis, and continuous improvement activities.
• More information about NXP in Greater China... #LI-2370