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What You'll Do
- Lead the layout implementation of complex analog, mixed-signal, and custom digital blocks.
- Drive floorplanning, device matching, routing strategies, and layout optimization to meet performance, area, power, reliability, and manufacturability requirements.
- Perform and review physical verification activities, including DRC, LVS, ERC, EM/IR, latch-up, density, and reliability checks.
- Collaborate closely with design, verification, technology, and product engineering teams to resolve layout-related challenges and achieve project milestones.
- Support advanced-node technologies, including FinFET processes, and contribute to methodology improvements and best practices.
- Provide technical guidance and mentorship to junior engineers and contractors.
- Assess project risks, estimate layout effort, and drive execution to meet aggressive schedules.
- Expected Competencies Strong expertise in analog layout techniques, matching, shielding, noise isolation, ESD-aware layout, power distribution, and high-performance routing.
- Excellent understanding of semiconductor process technologies, including planar and FinFET nodes.
- Proficiency with industry-standard EDA tools and physical verification flows.
- Ability to independently make technical trade-offs and solve complex implementation issues.
- Strong communication and stakeholder management skills.
- Proven track record of successful tape-outs and delivery of high-quality silicon.
- Impact and Leadership Recognized technical expert within the layout organization.
- Influences project execution and physical design methodologies across multiple programs.
- Contributes to organizational capability growth through mentoring, reviews, and knowledge sharing.
- Plays a key role in achieving project schedules and silicon quality targets.
- Qualifications BSEE or MSEE.
- Approximately 8-12+ years of custom analog/mixed-signal layout experience in deep sub-micron CMOS.
- Expert in Cadence Virtuoso XL, Floorplanning, Constraint Driven Layout, and PVS DRC/LVS/ERC.
- Strong knowledge of matching, common centroid, shielding, EM/IR, high-speed routing, parasitics, and DFM practices.
- Proven experience leading analog-on-top and digital-on-top chip layouts.
- Experience with floorplanning, power distribution, ESD, and multiple voltage domains.
- Familiarity with PLL, OSC, ADC, DAC, LDO, Bandgap, and high-speed interface circuits.
- Excellent communication and cross-functional leadership skills.
- Fluent in English SKILL or Perl scripting is a plus. ----------- NXP is committed to equal pay for equal work and work of equal value and applies fair, consistent and transparent remuneration practices.
- As of the date of this posting, the estimated gross annual base salary range for this position in Italy is between 50,600 € and 69,600 € annually.
- This range is intended as a guideline.
- Actual compensation may vary based on qualifications, experience, skills, and specific business or organizational needs.
- This position falls under the applicable National Collective Labour Agreement (Metalmeccanica Industria).
- Where relevant, the total compensation package may also include additional elements such as annual incentive opportunities and/or equity, along with a competitive benefits package.
- More information about NXP in Italy... ----------- #LI-7795
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Specialisation
Salary range
₹4-10 LPA to ₹40-75 LPA
Open roles at NXP Semiconductors
814 positions
Job ID
/job/Catania/Senior-Analog-IC-Layout-Engineer---MCU_R-10066873
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