Semiconductor Packaging Engineer

About This Role

• Understand the semiconductor market and translate market requirements to packaging effectively.
• Responsible for the design, development, execution, and implementation of packaging product, structures, or assembly process technologies.
• Address and solve materials and processing issues that may occur during the development process.
• Develop solutions by working closely with Package Innovation teams including Design, Materials, Modeling (electrical/thermal/mechanical) and Package Processing.
• Familiar with project management by using industry standard project management tools.
• Collaborate with NXP internal assembly sites and OSATs to qualify product package solutions.
• Investigate the feasibility of emerging technologies and capabilities to potential semiconductor packaging and assembly process.
• Then, effectively develop or design the implementation of these into manufacturing.
• Maintain substantial knowledge of state-of-the-art principles and theories and may contribute to scientific literature and conferences.
• May also participate in development of patent applications.
• May involve international travel to package assembly sites and NXP suppliers.