PROCESS ENGINEER

Overview

• Job Duties: Own and sustain Die Attach processes, including parameter control, material management, and process stability Monitor daily performance, yield, scrap and drive corrective actions when deviations occur Lead structured problem-solving for issues such as die tilt, epoxy flow, voids, curing issues, glue discoloration, and material variation Support NPI activities: DOE, machine capability studies, qualification runs, documentation, and customer audits Optimize processes for yield improvement, cost reduction, cycle time reduction, and equipment efficiency Collaborate closely with Production, Equipment Engineering, QA, PE, and suppliers to resolve issues and implement improvements Evaluate and qualify materials (epoxies/glue), tools (nozzles, collets), and die bonding equipment Maintain and update engineering documents (WI, OCAP, FMEA, Control Plan, parameter specification) Ensure safety, quality, and process compliance according to company standards Job Requirement : Bachelor’s or Master’s degree in Electronics, Electrical, Mechanical, Materials Engineering, or related field.
• 2+ years of experience in Die / Component Attach & Cure processes or related assembly/front‑end semiconductor processes.
• Strong background in process sustaining, yield improvement, and defect reduction in high‑volume manufacturing FMEA and Control plan.
• Demonstrated capability in process change management, including risk assessment, qualification, and controlled implementation across manufacturing sites.
• Strong collaboration skills working with global teams, suppliers, and cross‑functional partners.
• Excellent communication and presentation skills for technical and management audiences.
• Self‑driven, disciplined, and capable of working independently with strong ownership.
• Proficient in Microsoft Office tools for analysis, reporting, and presentations More information about NXP in Thailand..