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What You'll Do
- End-to-End Project Ownership : Own SoC program execution from project definition through tape-out and post-silicon support.
- Ensure on-time, high-quality delivery of key milestones and coordinate engineering support during silicon bring-up, validation, and debug.
- Technical Leadership : Drive technical decision-making across architecture, integration, verification, implementation, validation, and system teams.
- Serve as the overall technical execution owner for assigned projects.
- Cross-Functional Coordination : Lead and align Architecture, RTL, DFT, Verification, Emulation, Physical Design, AMS, IP, and related engineering teams.
- Resolve technical dependencies, execution bottlenecks, and critical project risks.
- Program Execution & Risk Management : Develop and maintain project execution plans together with PMO and SoC PM.
- Monitor schedule, resource demand, critical paths, and risk mitigation plans; drive recovery actions when milestones are at risk.
- Stakeholder Management : Partner with Product Marketing, System Architecture, System Engineering, NPI PM, BU management, and external stakeholders.
- Communicate project status, technical readiness, key risks, and mitigation plans during management and milestone reviews.
- Tape-Out & Silicon Readiness : Own overall tape-out readiness, including integration quality, signoff closure, cross-functional alignment, and risk management.
- Coordinate post-silicon validation activities and engineering resources to support silicon bring-up and issue resolution.
- Requirements: Bachelor's degree or higher in Microelectronics, Electrical Engineering, or related disciplines. 6+ years of semiconductor industry experience.
- Proven experience in SoC development from architecture through tape-out.
- Strong understanding of SoC development flows including: Architecture, RTL Design, Integration, Verification, DFT, Emulation, Physical Design, Silicon Validation.
- Experience leading large cross-functional engineering teams.
- Strong project execution, planning, and risk management skills.
- Excellent communication, leadership, and stakeholder management capabilities.
- Ability to influence technical direction and drive execution in a matrix organization.
Nice to Have
- Previous experience as: Chip Lead / SoC Technical Lead / Chief Engineer / Project Technical Leader Experience with automotive, industrial, or safety-critical semiconductor products.
- Experience working with global development teams across multiple sites.
- Successful delivery of multiple SoC tape-outs and post-silicon product ramps.
- Core Competencies: Technical Leadership Cross-functional Collaboration Project Execution Excellence Risk Management Strategic Thinking Problem Solving & Decision Making Stakeholder Management Communication & Influence Customer Focus Results Orientation More information about NXP in Greater China... #LI-d6f4
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Specialisation
Salary range
₹6-14 LPA to ₹45-80 LPA
Open roles at NXP Semiconductors
805 positions
Job ID
/job/Shanghai-Pudong/Principal-SoC-Chip-Lead---Technical-Project-Lead_R-10065808-1
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