Plasma ETCH Process Engineer

Overview

• The Plasma Etch Process Engineer (G4) is responsible for sustaining and improving plasma etch processes to achieve safety, quality, cycle time, cost, and yield objectives within a semiconductor manufacturing environment.
• The engineer develops and qualifies process recipes, analyzes process and equipment data, drives root cause investigations, and implements corrective actions to improve manufacturing performance and product reliability.
• This role partners closely with equipment engineering, manufacturing, metrology, yield enhancement, and integration teams to resolve technical issues and support production goals.
• The engineer leads process characterization activities, executes experiments, and manages process changes through established change control and qualification procedures.
• A G4 engineer is expected to work independently on moderately complex technical problems, provide technical guidance to technicians and junior engineers, and contribute to continuous improvement initiatives across the factory.
• More information about NXP in the United States..
• NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law.
• In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.