Packaging development engineer

Overview

• The Senior Flip-Chip Front-End Packaging Development Engineer – Die Attach & Underfill is responsible for leading FC-FE process development, optimization, and integration activities for die attach and underfill process.
• This role requires strong technical capability in process characterization, DOE, troubleshooting, yield improvement, material qualification, and equipment readiness to support packages development and production release.
• The engineer will work closely with cross-functional teams to ensure robust process performance, manufacturability, reliability, and continuous improvement across flip-chip packaging platforms.
• Process Ownership & Optimization Take ownership of FC-FE die attach and underfill processes for semiconductor packages, including advanced package platforms.
• Define, develop, optimize, and maintain critical process parameters for die placement, bonding, reflow, underfill dispensing, cure, CSAM, and related process controls.
• Lead design of experiments (DOE) activities to improve process yield, product reliability, void control, fillet quality, underfill flow, curing profile, and CSAM performance.
• Diagnose and resolve complex front-end process defects through systematic analysis and data-driven decision-making.
• Advanced Troubleshooting & Yield Improvement Drive root cause analysis for yield excursions using structured problem-solving methodologies, including 8D, Fishbone, 5-Why, and FTA.
• Develop and implement corrective and preventive actions to sustain yield improvement and prevent recurrence.
• Monitor yield performance and initiate continuous improvement projects to enhance process capability.
• Analyze inline process data and reliability results to identify potential process risks and improvement opportunities.
• Tooling & Equipment Management Lead tooling, fixture, and dispense process improvements in collaboration with vendors to support first-time NPI-development requirements.
• Support die attach and underfill, CSAM equipment qualification, calibration, upgrades, and readiness for production deployment.
• New Product Leadership Lead process development activities for new packages from concept phase through production release.
• Conduct technology research, process characterization, and process window development to support NPI readiness.
• Collaborate with the design engineering team to define and validate Design for Manufacturability (DFM) requirements.
• Prepare and maintain process documentation, including specifications, work instructions, control plans, and related technical records.
• Material & Process Integration Evaluate and qualify FC-FE-related materials, including die attach materials, flux, underfill, and associated consumables to support process performance, manufacturability, and reliability requirements.
• Work closely with supplies to address material-related issues, drive improvements, and support qualification activities.
• Access interactions among die attach process design, underfill material properties, curing conditions, CSAM results, package structure, and reliability performance to ensure robust process integration.
• Establish underfill inspection and acceptance criteria, including CSAM verification for voids, delamination, non-wet, flow coverage, and cure-related defects.
• Experience or familiarity with AI-based simulation tools will be considered an advantage.
• Cross-Functional & Leadership Role Serve as the technical lead across operations, quality, product engineering, suppliers, and subcontractors to ensure process alignment and performance.
• Mentor junior engineers and technicians in process development, equipment troubleshooting, and structured problem-solving.
• Provide proactive technical support for failure analysis reviews, risk assessments, and cross-functional technical discussions.
• Qualifications Education Bachelor’s degree in Mechanical Engineering, Materials Science, Chemical Engineering, or a related discipline.
• Experience Minimum of five years of experience in semiconductor packaging, with strong exposure to FC-FE die attach, and underfill dispensing processes.
• Familiarity with the end-to-end flip-chip process flow will be considered an advantage.
• Demonstrated hands-on experience in high-volume manufacturing and fast-paced development environments.
• More information about NXP in Malaysia..