Package Thermal & Mechanical Simulation Engineer

What You'll Do

• Be a part of the on-site Package Innovation simulation team at NXP Austin and collaboratively solve engineering questions for package development projects.
• Collaborate with product development teams and package project leads in support of risk mitigation and design optimization.
• Support problem-solving of package related issues during lifetime testing.
• Analyze thermal performance of products.
• Your team The modelling team’s responsibility is to support new product and technology developments with thermal and mechanical modelling.
• When unexpected results are found during testing the simulation team helps with root cause finding and deriving potential solutions.
• The team has a global presence but also has several other members on site in Austin.
• The team reports into the Package Core Technologies department within Package innovation and will interface with several other internal departments, including all the business lines.
• Your profile To be successful in this role you have: A Master or Ph.D. degree qualified in Mechanical Engineering or equivalent is required Experience with Finite Element Modelling, preferably with Ansys or Marc Mentat Fluent in English Understanding of semiconductor packaging technologies is preferred.
• Willingness to be present on site for at least 3 days/week Furthermore, you are: An excellent communicator, teamplayer, influencer and networker.
• A self-starter with initiative, flexibility and command skills.
• More information about NXP in the United States...
• NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law.
• In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals. #LI-97b2