NPI Process Development Engineer

Overview

• Responsible to develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications.
• Responsible for quality , yield , cost and process improvement activities.
• Responsible for process documentation , process spec , standard work instruction , OCAP , QIT etc.
• Need to collaborate closely with cross functional team members to resolve conflicts and make fast decision to avoid any risk to the organization/company/customer.
• Take ownership to work closely with upper management to align scope and direction of key projects.
• Requirements: •3-6 years of work experience with semiconductor assembly background for automotive customers.
• Experience in LQFP, MAPBGA , SiP , FCCSP , FCBGA etc.
• packing development will be an added advantage.
• Good technical knowledge and hands-on experience in process characterization for key processes such as laser dicing , plasma dicing , mechanical saw , die bond , wire bonding , mold , ball attach , marking , singulation etc.
• Candidate must have great interpersonal skills, leadership skills, result orientated, self-driven and eager to strive for success.
• Good SPC, Process Control and other relevant statistical & problem-solving skills • Good in Microsoft application (PowerPoint, Excel Macro, Word, etc.).
• Project Management knowledge is an added advantage.
• More information about NXP in Malaysia..