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Overview
- Understanding the reliability of advanced laminate-based electronic packages at NXP We are looking for a highly motivated student that will help us with investigating and understanding the boundaries of the reliability of advanced laminate-based electronic packages with complex multi-material interfaces.
- These packages may be exposed to humidity with electrical bias and/or thermo-mechanical loading over long durations.
- It is essential to understand the underlying degradation with failure analysis techniques and failure mechanisms in order to assess the reliability of these systems in real-world applications (e.g.
- automotive and industri al).
- Your team This opportunity is within the Product Quality & Diagnostic Center (PDQC) team.
- PDQC’s mission is to ensure robust product quality and reliability throughout development and qualification, enabling successful introduction of new technologies into production.
- PDQC accomplishes this mission through several key objectives: · Drive product qualification and reliability assessment for new technology developments.
- · Support failure analysis and root cause understanding across development and qualification phases.
- · Define and implement reliability test methods, hardware, and evaluation strategies.
- · Enable continuous improvement of product robustness through data-driven insights and collaboration.
- What’s in it for you · A great opportunity to develop your skills (technical, soft skills, communication, etc.).
- · Gaining experience in a multinational and diverse environment.
- · Working on real assignments which contribute to NXP’s objectives.
- Your Profile · Internship for Master of Science in Microelectronics · Affinity with semiconductor, reliability and physics.
- · Team player, willing to work in international and multi-disciplinary teams.
- · Flexible and able to multi-task.
- · Excellent communication skills, both verbal and written in English.
- More information about NXP in the Netherlands..
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/job/Nijmegen/Internship---Understanding-the-reliability-of-advanced-laminate-based-electronic-packages-at-NXP_R-10065970
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