Internship - Package Mechanical Simulation

Qualifications

• The candidate must be pursuing a Master's degree in Mechanical Engineering, Materials Science, Physics, Computational Engineering, Applied Mathematics, Electrical Engineering, or a related technical discipline.
• Strong interest in materials modeling, reliability engineering, computational mechanics, or semiconductor packaging technologies.
• Basic understanding of material behavior, deformation mechanisms, fracture, fatigue, or microstructural evolution is highly desirable.
• Experience with programming and scientific computing using Python, MATLAB, C++, or similar languages.
• Familiarity with numerical modeling techniques such as finite element methods, computational materials science, or multi-physics simulations is a plus.
• Ability to interpret scientific literature and translate theoretical concepts into computational algorithms.
• Strong analytical and problem-solving skills with attention to model validation and accuracy.
• Self-motivated, proactive, and comfortable working independently while collaborating with research and engineering teams.
• Good written and verbal communication skills, including technical reporting and presentation.
• Career Development Opportunities Bright Minds.
• We believe that a key component to growing our business is to develop our people.
• To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills.
• Visit our careers website for more job information: https://nxp.wd3.myworkdayjobs.com/careers Commitment At NXP We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future.
• We remain steadfast in our commitment to sustainability and making measurable year-on-year progress.
• Also, we aim to create an inclusive work environment and we will not tolerate racism, discrimination or harassment of any kind.
• We have programs in place focused on diversity, inclusion and equality. https://www.nxp.com/company/about-nxp/diversity-equality-and-inclusion:DIVERSITY-AND-INCLUSION This internship offers an opportunity to work at the intersection of materials science, reliability engineering, and advanced simulation, contributing directly to the development of next-generation semiconductor packaging technologies and predictive reliability methodologies.
• More information about NXP in the Netherlands... #LI-f5d0