Field Applications Engineer (FAE) Intern - Summer 2027

Requirements

• Currently pursuing a Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, Mechatronics, or a related technical field.
• Rising junior, senior, or graduate student — expected graduation between December 2027 and June 2029.
• Cumulative GPA of 3.0/4.0 or higher.
• Authorization to work in the United States (no sponsorship available for intern roles).
• Availability for 12 weeks full-time during Summer 2027 (May–August).
• Preferred Qualifications Coursework or project experience in embedded systems, analog and digital circuits, computer architecture, microcontrollers/processors, wireless communications, power electronics, control systems, or semiconductor applications.
• Hands-on experience with microcontrollers, MPUs, FPGAs, development boards, evaluation kits, or reference designs; familiarity with ARM-based systems is a plus.
• Programming experience in C, C++, Python, or similar languages, with exposure to IDEs, SDKs, version control, RTOS basics, or embedded Linux.
• Familiarity with common embedded interfaces such as UART, SPI, I2C, CAN, USB, or Ethernet.
• Experience using or willingness to learn common lab equipment, schematic/PCB review, board bring-up, firmware debugging, sensor integration, motor control, edge AI, or robotics applications.
• Who Thrives Here You are curious about how semiconductor products solve real-world system problems and enjoy learning by building and testing.
• You approach debugging methodically: form a hypothesis, measure the system, isolate variables, and document the result.
• You communicate clearly with engineers, customers, sales teams, and non-technical stakeholders.
• You are proactive, take ownership, collaborate well, and adapt to changing priorities in a customer-focused environment.
• You are motivated to develop both technical expertise and business understanding while contributing to team results.
• What You'll Get Competitive paid hourly compensation.
• Dedicated FAE/TSE mentor and day-to-day manager support throughout the program.
• Hands-on exposure to the semiconductor applications cycle—from requirements discovery and technical evaluation through proof-of-concept and design-in support.
• Participation in intern cohort events, including professional development workshops, executive speaker sessions, and cross-functional networking opportunities.
• Access to structured learning on NXP product portfolios, embedded systems, customer applications, and the semiconductor industry.
• Potential relocation support or housing stipend (location-dependent).
• Consideration for a return full-time offer into NXP's TSAP program upon graduation.
• Locations Field Sales Offices across the United States — including but not limited to: Austin, TX | Detroit, MI | San Jose, CA Preferred location will be discussed during the interview process.
• Some local customer travel may be expected.
• How to Apply Submit your application through NXP's careers portal at nxp.com/careers.
• Applications are reviewed on a rolling basis.
• Early application is strongly encouraged — positions fill quickly.
• More information about NXP in the United States...
• NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law.
• In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals. #LI-e41b