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What You'll Do
- Perform die bond process task on quality hold material 2.Collaborate with equipment & manufacturing team to improve DB processes and techniques. 3.Assist in resolving DB-related issues to minimize production downtime.
- Requirements: 1.Diploma or above in Engineering or a related field. 2.Working experience with DB process is preferable and recommended. 3.Strong attention to detail and technical troubleshooting skills. #LI-DNI
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Specialisation
Open roles at NXP Semiconductors
773 positions
Job ID
/job/Kuala-Lumpur/FE-ASSY-DIE-BOND-PROCESS-TECHNICIAN_R-10065994
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