External Package Innovation Engineer

What You'll Do

• Role Owner (Strategic & Governance) Own and lead OSAT-wide and cross-OSAT initiatives Define and deploy standard development templates and success criteria across OSATs Drive deployment of Best Known Methods (BKM) and lessons learned Develop and maintain technology roadmap and capability assessment for each OSAT site Provide Package Innovation (PI) input for: External site sourcing strategy Site selection process (jointly with interface manager) Lead project governance , including: Overall project summaries Stoplight reporting Regular reviews per OSAT site ✅ 2.
• Supporter (Execution & Project Delivery) Support NPI & NTI projects executed at external OSAT factories Ensure OSAT compliance with: Development processes Required documentation/templates Drive alignment on SME (Subject Matter Expert) assignment at OSAT Support and resolve technical and project issues on-site and across time zones Ensure assembly readiness and safe production launch 🔹 Stakeholder Collaboration You will work closely with cross-functional teams, including: Project Leaders & Development Managers Designers & Materials Engineers Tech Integration & Modelling teams (Electrical, Mechanical, Thermal) API and WLP/PLP/FC SMEs OSAT partners 🔹 What We’re Looking For Strong experience in semiconductor packaging (especially with handson assembly process experience such as pre-assembly and wire bonding).
• Previous exposure to OSAT ecosystem is an added advantage.
• Proven ability to manage cross-site, cross-functional projects Solid understanding of NPI/NTI development flows Excellent stakeholder management and communication skills Ability to drive standardization, governance, and technical problem-solving 🌟 Why Join Us Opportunity to lead high-impact package innovation initiatives Work with global teams and OSAT partners for wide exposure and fast knowledge & skill growth Drive technology roadmap and next-generation packaging solutions More information about NXP in Malaysia... #LI-633a