Equipment Engineer

Overview

• ATKL Packing Material Coordinator, accountable to drive total ATKL packing cost implementation, packing material standardization and packing quality across 2.Work collaboratively with equipment, manufacturing & supplier to improve packing quality related 3.LeadTBE NPI for packing related and ensure timely execution.
• Lead or need to update SOP, SWE,OCAP, FMEA, Control plan related to packing process 5.Packing qualification (tray, carrier tape, cover tape, desiccant, hic, box, bubble wrap) 6.Update packing method changed in APL system 7.Packing material submission updating ( Enovia, Beeline, GMDM & MMPR) 8.APL full development and implementation 9.SOP, SWE,OCAP, FMEA, Control plan related to packing process 10.New item submit in MMPR GMDM for General Store ordering 11.Work with supplier on daily packing related issue.(ITW- Richard, CPAK- Sam DY on quality) additional requirement 1.
• Educational background : Engineering Degree (Electronics or Mechanical or Mechatronics or Chemical) 2.
• Preferred working experience in semiconductor manufacturing and vision inspection.
• Speedy, Multi-tasking, results-orientated and able to work in fast phase manufacturing environment.
• Open- minded, willing to accept new challenges and overcome it with positive attitude.
• M otivated team player with high level of ownership.
• Able to communicate with all levels of people.
• Knowledge/experience in programming language a plus.
• More information about NXP in Malaysia..