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Qualifications
- Technical Proficiency: Strong mechanical or electrical aptitude with hands-on experience with assembly equipment, preferably wire bonding process.
- Education: Ddiploma in electrical engineering, mechanical engineering, mechatronics, or a related field.
- Experience: 2 to 5 years of hands-on experience in a manufacturing, production, or engineering support role.
- Soft Skills: Detail-oriented problem-solving, strong communication, and effective teamwork in a fast-paced environment. #LI-DNI
Sourced directly from NXP Semiconductors’s career page
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Specialisation
Open roles at NXP Semiconductors
773 positions
Job ID
/job/Malaysia-home-based/Engineering-Technician_R-10066008
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