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Overview
- Perform machine setup, conversion, and qualification for wire bond equipment.
- Monitor daily production performance and ensure compliance with process specifications.
- Support production activities to achieve output, quality, and delivery targets.
- Perform lot buy-off and process verification before production release.
- Monitor critical wire bond parameters and maintain process stability.
- Conduct routine process audits and inspections.
- Perform process characterization and parameter optimization activities.
- Analyze process data and identify trends affecting quality or yield.
- Troubleshoot wire bond defects and supports engineers for root cause analysis Support cost reduction and productivity enhancement initiatives.
Sourced directly from NXP Semiconductors’s career page
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Specialisation
Open roles at NXP Semiconductors
773 positions
Job ID
/job/Kuala-Lumpur/BGA-WB-Process-Technician_R-10065997
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