Assembly Engineering Lead

Qualifications

• Bachelor Degree in relevant engineering fields 15 + Years of Experience in Semiconductor industry is mandatory Competent in package development and Wire Bond operation will be added advantage Certification or proven competency in problem solving, 8D, 3x5whys..
• Experience in running engineering teams in wire bond, die bond, or mold Strong leadership skills with good communication Excellent in logic thinking for data analysis and data interpretation skills Excellent in critical data-driven decisions Hands on, strong ownership, and able to collaborate as team player Key Competencies most required include: Drives Results Problem Solving Manages Ambiguity Collaborates More information about NXP in Greater China... #LI-6a60