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Qualifications
- Understanding of Plasma cleaning principle for wire bonding Integrity Chip die pad/wire type/Lead-post structures Bachelor's or Master's student in Material/Science/Electronic Engineering or related Available to work at least 3 days/week.
- Good verbal and written English communication skills MS Office or Programming skill Self-motivated, results oriented, willing and eager to learn, proactive attitude More information about NXP in Greater China... #LI-2370
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Specialisation
Open roles at NXP Semiconductors
743 positions
Job ID
/job/Kaohsiung/XMLNAME--2026-Internship-Program---Process-Engineer-Intern--Wire-Bonding-_R-10059580
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