Opens nxp.wd3.myworkdayjobs.com in a new tab
Qualifications
- Understanding of Plasma cleaning principle for wire bonding Integrity Chip die pad/wire type/Lead-post structures Bachelor's or Master's student in Material/Science/Electronic Engineering or related Available to work at least 3 days/week.
- Good verbal and written English communication skills MS Office or Programming skill Self-motivated, results oriented, willing and eager to learn, proactive attitude More information about NXP in Greater China... #LI-2370
Sourced directly from NXP Semiconductors’s career page
Your application goes straight to NXP Semiconductors.
More from NXP Semiconductors (607 roles)
Opens nxp.wd3.myworkdayjobs.com in a new tab
Specialisation
Open roles at NXP Semiconductors
607 positions
Job ID
/job/Kaohsiung/XMLNAME--2026-Internship-Program---Process-Engineer-Intern--Wire-Bonding-_R-10059580
Get matched to roles like this
Upload your resume once. We’ll notify you when matching roles open up.
Join talent pool — freeSimilar Other roles
Broadcom
Software Development Engineer in Test (SDET)
2 Locations|Other
Samsung Semiconductor
Staff Engineer, Compiler
San Jose, California, United States|Other
Samsung Semiconductor
Sr. Director Accounting
San Jose, California, United States|Other
Samsung Semiconductor
Senior Manager, Memory Sales
San Jose, California, United States|Other