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What You'll Do
- defining the chip pad ring, substrate interconnect scheme, and lead the package layout design process.
- We collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers.
- Work to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package! Communicate effectively with various teams throughout the company What we need to see: BSEE or equivalent experience.
- Minimum of 5+ years in board/system design.
- Experience with package design is preferred.
- Good understanding of transmission line theory, power delivery and signal integrity is desired.
- Strong programming and scripting skills in Perl, Python, Tcl desired, Cadence Skill and EXCEL familiarity are helpful.
- Enthusiastic and able to work with a minimum of supervision.
- You seek to solve complex technical problems.
- With competitive salaries and a generous benefits package, NVIDIA is widely considered to be one of the technology world’s most desirable employers.
- We welcome you join our team with some of the most hard-working people in the world working together to promote rapid growth.
- Are you passionate about becoming a part of a best-in-class team supporting the latest in GPU and AI technology? If so, we want to hear from you.
Sourced directly from NVIDIA’s career page
Your application goes straight to NVIDIA.
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Specialisation
Open roles at NVIDIA
2000 positions
Job ID
/job/Taiwan-Hsinchu/Senior-Packaging-Technical-Engineer---Hardware_JR2023111
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