Senior Packaging Technical Engineer - Hardware

What You'll Do

• defining the chip pad ring, substrate interconnect scheme, and lead the package layout design process.
• We collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers.
• Work to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package! Communicate effectively with various teams throughout the company What we need to see: BSEE or equivalent experience.
• Minimum of 8+ years in board/system design.
• Experience with package design is preferred.
• Good understanding of transmission line theory, power delivery and signal integrity is desired.
• Strong programming and scripting skills in Perl, Python, Tcl desired, Cadence Skill and EXCEL familiarity are helpful.
• Enthusiastic and able to work with a minimum of supervision.
• You seek to solve complex technical problems.
• With competitive salaries and a generous benefits package, NVIDIA is widely considered to be one of the technology world’s most desirable employers.
• We welcome you join our team with some of the most hard-working people in the world working together to promote rapid growth.
• Are you passionate about becoming a part of a best-in-class team supporting the latest in GPU and AI technology? If so, we want to hear from you. #LI-Hybrid